thanks kcress. Until 5 minutes ago I thought it is the CAT. Then I put a plastic pen on my ear and the other end on the CAT: silence. Then I tried the output cap (C4/5/6): bingo - that seems to be the source. Caps are the Mouser parts from the BOM.
I'll have a further look/ear at it tomorrow.
The board will be quite small. I have only thrown the components on a pcb for now, but it looks like everything will be able to fit in a roughly 30mm x 30mm area. I'm not sure yet if that will be the final size, but it will be within the small seed/tead studio size for sure.How big are the boards?
One. Given the price per board and the fact that this IC can easily drive 12 LEDs with 48V psu (or 2 x 24V), I don't see a reason to go with more.How many drivers are you looking at per board?
Current plan is to have Vin, GND, DIM (either PWM or Analog, jumper selectable), LED+ and LED-. So yes and yes.Will your boards have individual power inputs and/or individual dimmer control inputs?
Of course. Just need to sit down and finish itWill you be posting your PCB layout files for placing orders from seeedsrudio?
Unfortunately, it is the only package availableUm... Am I seeing an exposed pad MSOP package for the controller chip?
Yes, I've worked with SSOP28 and the wicking method seems to work well for small packages like that. Also using plenty of flux and just introducing a little bit of solder with the tip of the iron works. That's my experience anyway.Have you soldered 12mil pads with 8mil space? Do you realize you can't even buy solder that small? The solder is as wide as two pads. It's pretty sketchy.
Not reflowing. No clue how to do it anywayIf you're going to reflow this are you aware of the cost of solder paste? Or how hard it is to screen the stuff on?
Do they really need to be connected? I realize that will help with cooling, but there is a dedicated GND pin. I any case I'll make sure they are plated through. The data sheet recommends 4 holes under it, but maybe that's for reflowing. I'll take a second look at that area.That chip needs to have that center pad connected to the back of the board. Are those plated-thru holes big enough for your solder to fit down so you can feed it through from the back? If not make one big one instead of 4 little ones.
Will do. Thanks a bunch!Only other comment is that angles less than 90 degrees where traces connect is considered 'bad form'. You might want to fix those.
Yes, I've worked with SSOP28 and the wicking method seems to work well for small packages like that. Also using plenty of flux and just introducing a little bit of solder with the tip of the iron works. That's my experience anyway.
Do they really need to be connected? I realize that will help with cooling, but there is a dedicated GND pin. I any case I'll make sure they are plated through. The data sheet recommends 4 holes under it, but maybe that's for reflowing. I'll take a second look at that area.
Yeah, that's what I meant by the 'the wicking method'. Was lazy describing itOK. Just so you know, often the easiest way is to just run a a huge blob of solder along each side. Solder all the pins together like they were one huge pin. Then come back in with solder wick. The wick will draw almost all of it back out leaving just the solder under the individual pins.
Wouldn't flux from under the chip and in the holes 'suck' the solder in just like it happens with through hole components? I admit, I've never soldered a pad like that, so have no clue, just guessing.Yes they need to be connected. That's what the plated thru holes do under the pad to the solder side plane. You don't need to do anything different if your solder can fit down those four holes as is. If you can't poke your solder down them then you need a bigger hole. Those were sized for re-flow. The designer wasn't thinking some foo would be hand soldering it.
Let us know how it goes. That's a good chip 'cept for soldering.
Often the cap and the board work together to make a speaker like those gift cards. You could try tomb-stoning the cap and then running a tiny wire from the top down to the board. That would completely decouple the cap and the board. Often the cap by itself is toooo small to make much noise.